A study of copper films obtained from the nebulized spray pyrolysis of different precursors

Aiyer, Hemantkumar N; Parashar, Sachin; Raju, A R; Shivashankar, S A; Rao, C N R

dc.contributor.author	Aiyer, Hemantkumar N
dc.contributor.author	Parashar, Sachin
dc.contributor.author	Raju, A R
dc.contributor.author	Shivashankar, S A
dc.contributor.author	Rao, C N R
dc.date.accessioned	2012-03-21T08:57:39Z
dc.date.available	2012-03-21T08:57:39Z
dc.date.issued	1999-01-07
dc.identifier	0022-3727	en_US
dc.identifier.citation	Journal Of Physics D: Applied Physics 32(1), 1-8 (1999)	en_US
dc.identifier.uri	https://libjncir.jncasr.ac.in/xmlui/10572/711
dc.description	Restricted Access	en_US
dc.description.abstract	Metallic copper films have been deposited on Si(100) substrates by nebulized spray pyrolysis of Cu(acac)(2), Cu(hfac)(2) and Cu(dpm)(2). The structure and morphology of the films have been examined by x-ray diffraction and scanning electron microscopy. The films are polycrystalline in nature with a preferred (lll) orientation. Based on the electrical resistivity data, various transport parameters of the film have been estimated. Growth kinetics and the environmental stability of the films from the precursors have been compared. Taking all the factors into account, Cu(dpm)(2) seems to yield the best films of copper metal.	en_US
dc.description.uri	http://dx.doi.org/10.1088/0022-3727/32/1/002	en_US
dc.language.iso	en	en_US
dc.publisher	IOP Publishing Ltd	en_US
dc.rights	© 1999 IOP Publishing Ltd	en_US
dc.subject	Chemical-Vapor-Deposition	en_US
dc.subject	Electrical-Resistivity	en_US
dc.subject	Electroless Copper	en_US
dc.subject	Thin-Films	en_US
dc.subject	Growth	en_US
dc.subject	Surfaces	en_US
dc.subject	Lanio3	en_US
dc.title	A study of copper films obtained from the nebulized spray pyrolysis of different precursors	en_US
dc.type	Article	en_US