Abstract:
Metallic copper films have been deposited on Si(100) substrates by nebulized spray pyrolysis of Cu(acac)(2), Cu(hfac)(2) and Cu(dpm)(2). The structure and morphology of the films have been examined by x-ray diffraction and scanning electron microscopy. The films are polycrystalline in nature with a preferred (lll) orientation. Based on the electrical resistivity data, various transport parameters of the film have been estimated. Growth kinetics and the environmental stability of the films from the precursors have been compared. Taking all the factors into account, Cu(dpm)(2) seems to yield the best films of copper metal.
